Outline
Day One
Fundamentals
• Electrical signals • Maxwell vs. Kirchhoff: limits of circuit theory • Decibel and logarithmic scales • Spectrum of a signal: time domain vs. frequency domain • Resonance • Quality factor (Q) both loaded and unloaded •
Bandwidth •
Impedance matching definition • Frequency vs. dimensions (size) • Time vs. distance • Scattering parameters (s-parameters) • Typical formats and how to measure them
High speed/frequency effects in electronic circuits: when a capacitor is an inductor
• High speed and RF effects: attenuation, gain, loss and distortion • Skin effect, return current and parasitic effects • The importance of rise time and fall times (dv/dt and di/dt) • Controlling signal return currents, differential vs. common mode currents • Introduction • Non ideal components • The "hidden schematic" concept
- Resistors, capacitors and inductors
- Ferrites
- Transformers
- Diodes
- Transistors
- ICs • Digital and high speed circuit key parameters
- power, speed and package • Wires •
Cables and connections basics • PCB structures (dielectric materials, structures, dissipation factor, the multi-layer structure idea) •
Transmission lines basics • Lumped vs. distributed systems •
Vias (effects and modelling in high frequency) • Shielding basics • Clocks
Transmission lines: controlling propagation
• Wiring and connecting components
- limitations for high frequency and high speed systems •
What is a transmission line? • Motivation: signal propagation • Modelling a transmission line
- Characteristic impedance
- Velocity of propagation • description of typical transmission lines
- coax, pairs, microstrip and stripline • Reflection coefficient • Standing wave ratio (SWR, VSWR and ISWR) and Return loss • Intuitive explanation • Examples from real world
Matching: Avoiding reflections. Obtaining maximum power transfer
• Maximum transfer of power and avoiding reflections • Matching with LC components • Matching networks: L, PI and T networks • Matching in narrow and broadband networks • Matching with transformers • Matching with transmission lines • Terminations to avoid SI/EMI problems: solutions and techniques • Using software to design a matching network • Examples from real world
Day Two
Signal Integrity Parameters
• What is Signal Integrity (SI) in electronic circuits? • undesired effects • Propagation time and delay • Reflections and ringing • Inductive vs. capacitive coupling
- crosstalk (near and far) • Delays •
Jitter • Ground bounce • Power supply noise • High frequency, dv/dt and di/dt
Grounding: the most important subject
• Signal ground vs. safety ground • Ground in high frequency/speed applications
- low impedance path • Minimizing ground impedance • Common impedance •
Ground strategies (single point, multipoint, and hybrid) • Ground loops
Filtering
• Basic ideas • Filters for known impedances (no EMI applications) • Basic design techniques with examples •
Filters for EMI/EMC • How filters work: reflection vs. dissipation • Insertion losses • Source and load influence • Parasitic and location effects • Filtering with ferrites • Saturation and undesired coupling effects • Decoupling and bypass fundamentals • Damping resonances and ringing • Three terminal and feed through components
Printed Circuit Boards (PCBs)
• Basic ideas • Design strategy • Partitioning and critical zones • PCB structures
- dielectric materials, structures, dissipation factor •
Choosing the PCB structure: how many layers and distribution • Power planes design and distribution • Layout and routing (1, 2 and multilayer) techniques
- traces
- microstrip and stripline
- corners
- vias
- controlling impedance for SI
- transmission line effects and solutions • Ground planes • Splits or ground discontinuities in planes (slots) • Decoupling and bypass (how, where, resonances, etc): discrete capacitors vs. embedded techniques in high speed/RF designs • Crosstalk and guards • How ground plane layout affects crosstalk • Mixed signal PCBs (A/D designs) • Controlling clock waveform • Clock distribution • Clock shielding • Examples from real world
Day Three
Cables
• Basic ideas for cable fundamentals • The control of return current • Types of cables (wires, twisted pairs, coax, shielded cables, ribbon cables, etc.) •
Cable impedance • Shielded cables and cable grounding •
Connectors • Parasitics in connectors for high speed signals •
Avoiding crosstalk and reflections in cables (layout and terminations) • Avoiding common impedance in cables • Reducing emissions and pick-up in cables • Examples from real world
Measuring and Troubleshooting Techniques
•
Antenna basics • How to measure EMI and SI effects
- tools, instruments and techniques • Scope and probe limitations • Review of some typical errors in measurement techniques • Measuring high frequency current in electronic circuits • Diagnostic and troubleshooting techniques and hints • Locating EMI sources with near field probes